Ali Hassan
2 min read
In This Article:
On May 22, Silicon Laboratories Inc. (NASDAQ:SLAB) announced the launch of its Series 3 portfolio of wireless SoCs.
Built on the advanced 22 nm process node, the Series 3 will power breakthroughs in computer power, energy efficiency, integration, and security. The Series 3, which includes SiXG301 and SiXG302 wireless SoC families, will address the growing demand for line-powered and battery-powered IoT devices.
A technician installing a complex of microcontrollers and internet of things devices inside a server rack.
Silicon Laboratories is using 22 nm process nodes to meet the growing demand for more powerful and far-edge devices across various IoT applications, including smart cities, industrial automation to health, smart homes, and beyond. One key aspect of these new SoCs is that they offer device makers a scalable, secure platform to build the next wave of innovative, high-performance IoT products.
"Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency. With the SiXG301 and upcoming SiXG302 families, we're delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they're plugged in or running on battery power,"
During Q1 FY2025, the company posted strong sales driven by double-digit growth in its Industrial & Commercial and Home & Life businesses, respectively. Silicon Laboratories is expanding its market share in the growing semiconductor industry, fueled by its innovative product offerings. The Series 3 portfolio adds advanced computing power and AI capabilities to its products.
Being a fabless semiconductor company, Silicon Laboratories Inc. (NASDAQ:SLAB) offers integrated hardware and software systems for customers to create advanced industrial, commercial, home, and life applications.
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Disclosure. None.
